Toshiba expanded the range of embedded Flash memory modules that match the itemspec eMMC 5.1. Feature of the new modules is guaranteed the preservation work in the temperature range from -40° to +105° c.
in new modules, suitable for use in industrial and consumer electronics, used 15-25nm NAND Flash memory.
Presented modules 8, volume 16, 32 and 64 GB. They are packed in 153-pin FBGA PACKAGING type chassis sizes 11.5 x 13 mm and thickness from 0.8 to 1.2 mm. Currently available trials samples and production supplies manufacturer expects to begin in March 2017 onwards.